Plastic-Vacuum Forming

Affordable & Quick Injection Molding Service

1. Competitive price with high quality

2. Knowledgeable and high precision

3. Stringent quality system

4. Planned delivery

Specification of Vacuum Forming China

Feature

Vacuum forming

Material

PS, PMMA, PE, PVC, PC, PET

ESD, Food

Surface treatment

None/Printing

Application

Industrial, communication, Electronical

As a Plastic-Vacuum Forming manufacturer, our company has plastic vacuum forming products for sale,If you need, please contact us in time.

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Eolane SCM - New Technologies

Groups Eolane New Technologies Eolane New Projects

Semi-Flex PCB

Semi flex PCB is a flex-rigid PCB, typically 4 layers, made entirely of FR4. Unlike conventional flex-rigid PCBs, the flexing element is not polyimide but a thin FR4 core with two layers of copper specially treated to flex without cracking. A less robust solution uses a depth-milled layer rather than a core. While this type of flexible circuit may be more expensive to design and produce, it does offer a number of important advantages. For instance, the reduced size makes it easier to fit more components into a smaller space. This can actually help to lower overall system costs. Additionally, because they require the need for fewer interconnects and related parts and components, these semi flexible pcb can also prove to be more reliable and require less maintenance in the long run. As with all types of flexible circuit boards, the semi-flex PCB will perform well in even the harshest environments, especially those featuring extreme heat. A semi-flex board is als...

HDI-High Density Interconnect

HDI boards, one of the fastest growing technologies in PCBs, are now available at Eolane SCM. HDI interconnect board contains blind and/or buried vias and often contains microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards. There are 6 different types of HDI high density interconnect boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs. HDI any-layer printed circuit boards are the next technological enhancement of HDI microvia printed circuit boards: all the electrical connections between the individual layers consist of laser-drilled microvias. The main advantage of this technology is that all the layers can be freely interconnected. To produce these circuit boards, RayMi...

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